Bit patterned growth guiding mechanism

ABSTRACT

The embodiments disclose a structure, including a first layer selectively etched on a substrate with a seedlayer deposited thereon, a first layer bit patterned growth guiding mechanism on the seedlayer, and a plurality of bit patterned magnetic recording features grown on the seedlayer guided by the growth guiding mechanism.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a block diagram of an overview of a bit patterned growth guiding mechanism of one embodiment.

FIG. 2 shows a block diagram of an overview flow chart of fabricating patterned media using an ALD chemical template pre-patterned seedlayer of one embodiment.

FIG. 3 shows a block diagram of an overview flow chart of fabricating patterned media using a modified chemical template pre-patterned seedlayer of one embodiment.

FIG. 4 shows a block diagram of an overview flow chart of fabricating patterned media using a topographical template pre-patterned seedlayer of one embodiment.

FIG. 5 shows a block diagram of an overview flow chart of fabricating patterned media using a double density ALD chemical template pre-patterned seedlayer of one embodiment.

FIG. 6 shows for illustrative purposes only an example of pre-patterned media growth process ALD chemical template of one embodiment.

FIG. 7 shows for illustrative purposes only an example of a growth guiding mechanism of one embodiment.

FIG. 8A shows for illustrative purposes only an example of pre-patterned media growth process using an ALD chemical template on hexagonal arrays of cylindrical islands of one embodiment.

FIG. 8B shows for illustrative purposes only an example of magnetic BPM grain growth at pre-patterned sites from the bottom up of one embodiment.

FIG. 9 shows for illustrative purposes only an example of pre-patterned media growth process modified chemical template of one embodiment.

FIG. 10 shows for illustrative purposes only an example of pre-patterned media growth process topographical template of one embodiment.

FIG. 11A shows for illustrative purposes only an example of a pre-patterned media growth process using a double density ALD chemical template of one embodiment.

FIG. 11B shows for illustrative purposes only an example of double density magnetic grain growth at pre-patterned sites of one embodiment.

FIG. 12A shows for illustrative purposes only an example of bit patterns on arrays of square islands of one embodiment.

FIG. 12B shows for illustrative purposes only an example of resist layer patterned in arrays of square islands of one embodiment.

FIG. 12C shows for illustrative purposes only an example of etched patterned spacer layer in arrays of square islands of one embodiment.

FIG. 12D shows for illustrative purposes only an example of an etch to remove planar sections of the spacer layer of one embodiment.

FIG. 12E shows for illustrative purposes only an example of double density magnetic grain growth at pre-patterned sites of one embodiment.

FIG. 12F shows for illustrative purposes only an example of double density HAMR-BPM magnetic alloy bits in arrays of square islands of one embodiment.

DETAILED DESCRIPTION

In a following description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration a specific example in which the embodiments may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope.

It should be noted that the descriptions that follow, for example, in terms of a bit patterned growth guiding mechanism is described for illustrative purposes and the underlying system may apply to any number and multiple types of perpendicular magnetic recording media including bit patterned media and heat assisted magnetic recording media and combinations of them. In one embodiment, the bit patterned growth guiding mechanism may be configured using selectively etching a first layer of a substrate to create a bit patterned growth guiding mechanism. The bit patterned growth guiding mechanism may be configured to include growing bit patterned magnetic features guided by the growth guiding mechanism of one embodiment.

Bit patterned media (BPM) uses processes to make patterned arrays of spaced magnetic pillars or particles with center to center spacing in the range of about 5-30 nm. Fabrication methods try to carefully control the particle size; particle separation; particle position; particle crystallographic, magnetic, and microstructural properties; interparticle interactions; etc.; to provide effective BPM recording media. Many patterning procedures comprise depositing the magnetic material onto appropriate seedlayers, often by sputter deposition, to produce a blanket thin film of a predetermined structure and composition. The material is then patterned into the predetermined pillar structure (dots, islands) removing magnetic material in regions between the predetermined pillar locations (trenches).

Such removal is generally performed by ion beam etching through a mask to selectively remove material in predetermined locations. The selectivity of the etching process may not be perfect. Thus, the sensitive magnetic properties of the recording layer may be damaged by stray ion implantation at the pillar edges as well as through the mask. The etch process generally has limited aspect ratio, and normally has to be greater than 10 nm deep, to remove the entire magnetic layer. This causes more damage to the top of the pillars and limits the position control and isolation of very small scale pattern features. This process results in a larger than predetermined variation of feature sizes that increases with the depth of the pattern feature. After conventional patterning processes, refill and planarization are used so as to provide a flyable head-disk interface. Such extra processes may add complexity and cost.

HAMR media inherently have a very limited known workable materials set. MgO is capable of providing the growth template, diffusion barrier, thermal resistor, etc., to form a high anisotropy, exchange decoupled L10 FePt alloy magnetic recording layer. This material combination is extremely difficult to manufacture owing to low conductivity for sputter processing and high particle generation of MgO combined with the difficulty of particle isolation and high temperature phase ordering of FePt alloys.

The current embodiments provide 1. rectified intrinsic magnetic material properties of the post-patterning features, 2. Steeper, more vertical side-walls on patterned features, 3. More accurate positioning of the pattern features, 4. More accurate control of the spacing between pattern features, 5. More uniform spacing between pattern features, 6. Control of the composition profile of materials in the spacing between pattern features, 7. Reduced surface topography (roughness) of the post-patterning device.

FIG. 1 shows a block diagram of an overview of a bit patterned growth guiding mechanism of one embodiment. FIG. 1 shows depositing a seedlayer on a substrate 100 and forming a first layer on the seedlayer using an ALD chemical template 120, where ALD refers to an Atomic Layer Deposition. FIG. 1 also shows forming a first layer on the seedlayer using a modified chemical template 130, forming a first layer on the seedlayer using a double density ALD chemical template 150, and forming a first layer on the seedlayer using a topographical template 140. The process continues with creating a growth guiding mechanism in accordance with the pre-patterned first layer. The process includes selectively etching a first layer of a substrate to create a bit patterned growth guiding mechanism 160. A process is used for depositing magnetic grains on exposed seedlayer surfaces 170. Growing bit patterned magnetic recording features guided by the growth guiding mechanism to a predetermined pillar height 180 fabricates the bit patterned magnetic recording features without damage from etching the bit patterned magnetic recording features.

The bit patterned growth guiding mechanism allows growing the magnetic grains perpendicular to the seedlayer to a predetermined pillar height. The predetermined pillar height includes the height of 3-dimensional extruded magnetic features including cylindrical shaped magnetic features (cylinders), cuboid shaped magnetic features including square and rectangular patterned extrusions (squares and/or square islands), and bit patterns using other shapes and orientations. Growing the magnetic grains perpendicular to the seedlayer includes growing grains inside the cylinders, square islands and other shapes and orientations. The boundaries of the 3-dimensional extruded magnetic features are defined by the growth guiding mechanism in accordance with the pre-patterned seedlayer. The perpendicular growth creates vertical sides of the grown magnetic pillar grains that forms the perpendicular magnetic recording magnetic features without having to perform an etch to remove material to form the patterned features thereby preventing damage to the magnetic materials of one embodiment.

FIG. 2 shows a block diagram of an overview flow chart of fabricating patterned media using an ALD chemical template pre-patterned seedlayer of one embodiment. FIG. 2 shows a process that includes depositing a seedlayer on a substrate 100 and forming an ALD chemical template first layer on the seedlayer 200. Processing to form the ALD chemical template first layer continues with depositing a resist layer on the seedlayer 210 and performing a block co-polymer directed self-assembly or nano imprinting on the seedlayer to create patterned features 220. The process continues by depositing a conforming spacer layer over the patterned features 230 and selectively etching the conforming spacer layer to remove the spacer layer material on the tops of the patterned features and resist 240. The process includes removing the patterned resist to expose portions of the seedlayer 250 thereby forming the ALD chemical template first layer. Steps in the process for creating a growth guiding mechanism in accordance with the ALD chemical template first layer include depositing a magnetic segregant on the remaining spacer layer 280. The process includes depositing magnetic grains on exposed seedlayer surfaces 170. The process includes depositing magnetic grains on exposed seedlayer surfaces 260. The process includes growing magnetic recording features perpendicular to the substrate as guided by the growth guiding mechanism to a predetermined pillar height 290. Vertical sides of the magnetic grain pillars are maintained by segregating the growth of magnetic grains and magnetic alloy segregant. The cylinders, square islands and other shapes and orientations in which the magnetic grains are grown inside of are shapes formed using the magnetic alloy segregant. The vertical sides of the shapes being a magnetic alloy segregant inhibits the growth of the magnetic grains from growing outwardly and/or laterally through the magnetic alloy segregant sides. This guides the growth of the magnetic grains perpendicularly from the surface of the seedlayer within the vertical sides of the magnetic alloy segregant shapes. The vertical growth guidance of the growth guiding mechanism produces perpendicular magnetic recording magnetic features without a process to vertically etch the features thereby eliminating a fabrication step that may cause damage to the physical and magnetic properties of the magnetic features of one embodiment.

FIG. 3 shows a block diagram of an overview flow chart of fabricating patterned media using a modified chemical template pre-patterned seedlayer of one embodiment. FIG. 3 shows a process including depositing a seedlayer on a substrate 100 and forming a modified chemical template first layer on the seedlayer 300. The process continues with depositing a resist layer on the seedlayer 210 and performing a block co-polymer directed self-assembly or nano imprinting on the seedlayer to create patterned features 220. Processing continues with creating a growth guiding mechanism in accordance with the modified chemical template pre-patterned layer including a process to selectively oxidize portions of the seedlayer adjacent to the patterned features 330. Process steps include stripping resist residue to expose the non-oxidized patterned seedlayer 340 and depositing magnetic grains on exposed seedlayer non-oxidized surfaces 345. This promotes growing magnetic recording features perpendicular to the substrate as guided by the growth guiding mechanism to a predetermined pillar height 290 of one embodiment.

FIG. 4 shows a block diagram of an overview flow chart of fabricating patterned media using a topographical template pre-patterned seedlayer of one embodiment. FIG. 4 shows a process including depositing a seedlayer on a substrate 100 and forming a topographical template first layer on the seedlayer 400. Processing continues with depositing a resist layer on the seedlayer 210 and performing a block co-polymer directed self-assembly or nano imprinting on the seedlayer to create patterned features 220. The process continues with selectively etching the seedlayer to transfer the patterned features into the seedlayer 410. Process steps include removing the patterned resist to expose the patterned seedlayer 420 and depositing a magnetic alloy segregant between the patterned seedlayer features to create a growth guiding mechanism 450. The steps continue with depositing grains of a magnetic alloy on the top surfaces of the patterned seedlayer features 430. The process continues creating a growth guiding mechanism in accordance with the topographical template first layer. The topographical template first layer is formed by selectively etching the seedlayer to transfer the patterned features into the seedlayer 410, removing the patterned resist to expose portions of the pre-patterned seedlayer 420 and depositing a magnetic alloy segregant between the patterned seedlayer features to create a growth guiding mechanism 450. The process includes growing magnetic recording features perpendicular to the substrate as guided by the growth guiding mechanism to a predetermined pillar height 290 of one embodiment.

FIG. 5 shows a block diagram of an overview flow chart of fabricating patterned media using a double density ALD chemical template pre-patterned seedlayer of one embodiment. FIG. 5 shows a process including depositing a seedlayer on a substrate 100 and forming a double density ALD chemical template first layer on the seedlayer 500. The process continues with depositing a resist layer on the seedlayer 210 and performing a block co-polymer directed self-assembly or nano imprinting on the seedlayer to create patterned features 220.

Processing includes depositing a conforming spacer layer over the patterned features 230 and selectively etching the conforming spacer layer to remove the spacer layer material on the tops of the patterned features and resist 240. The process continues with removing the spacer layer oriented in the plane of the seedlayer to expose portions of the surface of the seedlayer 510. A process is used for creating a growth guiding mechanism in accordance with the double density ALD chemical template first layer. The processing includes depositing a magnetic alloy segregant on top of the remaining vertical spacer layer sections 530. The processing includes depositing magnetic grains on exposed seedlayer surfaces 170. The process includes growing magnetic recording features perpendicular to the substrate as guided by the growth guiding mechanism to a predetermined pillar height 290 of one embodiment.

The growth guiding mechanism may be chemical. Metals stick well to metals but poorly to oxides, nitrides, carbides, borides, etc., while oxides for example stick well to oxides, but poorly to metals. The growth guiding mechanism include features to create a two-phase microstructure comprising a metal and a nonmetal which may be maintained during sputter film deposition on a coating of filler seed material of one embodiment.

The growth guiding mechanism may be physical. Metal grains nucleate in oriented fashion on a flat pillar region, but may be unable to do so in a very narrow trench. The nucleated metal grains form low profile (1-2 nm or less) BPM patterned guiding features. The formation includes a low profile etch process and a low profile deposition process of one embodiment.

Pillar and trench regions may be coated with materials having interface energies with the subsequently deposited material(s) that are very different. A spacer layer atomic layer deposition or PECVD is used for causing highly preferential “sticking” of subsequently deposited materials in a chemical pre-patterned media growth guiding mechanism of one embodiment.

A patterned deposition of a mask or resist layer is followed by a spacer layer atomic layer deposition or PECVD. A selective etch to remove sections of the spacer layer and patterned resist layer is used to create a pre-patterned growth guiding mechanism structure. The selective etch includes a grazing angle etch to selectively remove sections of the spacer layer on top of a patterned resist and removal of the resist. A pre-patterned media growth guiding mechanism is deposited on the remaining spacer layer. The pre-patterned media growth guiding mechanism includes a deposited magnetic alloy segregant wherein a deposition of a magnetic alloy segregant includes an oxide material that deposits preferentially on the pre-patterned spacer layer.

A deposition of a magnetic alloy includes metallic FePt grains deposited onto the exposed seedlayer surfaces. The metallic FePt grains stick preferentially to the pre-patterned seedlayer on one embodiment. Segregated growth of magnetic grains and magnetic alloy segregant enables growth of magnetic grains from the surface of and perpendicular to the seedlayer to a pre-determined height forming bit patterned magnetic recording features. The perpendicular growth of the magnetic grains includes features including steeper, vertical side-walls on patterned features, accurate positioning of the pattern features, accurate control of the spacing between pattern features, uniform spacing between pattern features, prevents damage from conventional after growth processes and enables thinner means for higher density and accuracy of one embodiment. The perpendicular growth of the magnetic grains includes features including intrinsic magnetic material properties of the post-patterning features, thermodynamic control of sigma to control pattern size, control of the composition profile of materials in the spacing between pattern features, reduced surface topography (roughness) of the post-patterning device, and uniformity of pattern size and aspect at high density of one embodiment.

A typical layer structure of perpendicular magnetic recording (PMR) media stack includes a protective and lubricating layer, perpendicular magnetic (recording) layer, interlayer, soft underlayer (SUL) and a substrate of one embodiment.

A typical layer structure of heat assisted magnetic recording (HAMR) PMR media stack includes a protective and lubricating layer, perpendicular magnetic (recording) layer, interlayer, thermal resistor (TR) layer, heatsink (HS) layer, soft underlayer (SUL), and a substrate of one embodiment.

Examples of pre-patterned media growth process layers and materials include a seedlayer including titanium nitride (TiN), platinum (Pt), chromium alloys (CrX), magnesium oxide (MgO), and other seed materials of one embodiment. The pre-patterned media growth process layers and materials include a resist layer including imprint resist, directed self-assembly resist, other mask or resist materials of one embodiment.

The pre-patterned media growth process layers and materials include a spacer layer including oxides or metals materials of one embodiment. The pre-patterned media growth process layers and materials include a perpendicular magnetic (recording) layer including magnetic alloy, iron platinum (FePt), and other metal materials of one embodiment. The pre-patterned media growth process layers and materials include a magnetic alloy segregant layer including carbon (C), silicon oxide (SiO2), other materials including oxides, nitrides, carbides, borides of one embodiment.

FIG. 6 shows for illustrative purposes only an example of pre-patterned media growth process ALD chemical template of one embodiment. FIG. 6 shows a pre-patterned media growth process using an ALD chemical template 640 including a deposition of seedlayer onto a substrate with soft underlayer deposited thereon 650. The structure includes the substrate 610, soft underlayer (SUL) 600 and the seedlayer 660.

A resist layer is deposited on the seedlayer 660. A block co-polymer directed self-assembly or nanoimprinting 670 is performed in the resist layer to form patterned resist features 620. An atomic layer deposition or PECVD 675 is used to deposit a conforming spacer layer 630 that conforms to the patterned resist features 620. A grazing angle etch to selectively remove tops of spacer layer 677 materials on the top surfaces of the patterned resist features 620. A grazing angle etch 695 does not remove other sections of the spacer layer 630. Spacer layer etched sections 635 surround the patterned resist features 620. A selective etch to remove the resist 680 is performed. The selective etching removes the sections of the spacer layer on top of patterned resist features 620 and the patterned resist features 620 thereby clearing exposed seedlayer surfaces 682 without affecting the substrate 610 and soft underlayer (SUL) 600 of one embodiment. The process is further described in FIG. 7.

FIG. 7 shows for illustrative purposes only an example of a growth guiding mechanism of one embodiment. FIG. 7 shows a continuation from FIG. 6 including deposited magnetic alloy segregant in accordance with pre-patterned sites 700. The deposited magnetic alloy segregant 705 on top of the remaining spacer layer etched sections 635 forms cylinders, square islands and other 3-D features that includes exposed surfaces of the seedlayer on the substrate 610, soft underlayer (SUL) 600 and seedlayer 660 structure. Magnetic grains are deposited on exposed seedlayer surfaces 720 where the exposed seedlayer surfaces 682 promote growth of the magnetic grains. Magnetic grain growth is guided by the growth guiding mechanism to a predetermined pillar height 760 occurs concurrently with a magnetic alloy segregant. The magnetic alloy segregant 705 inhibit magnetic grain growth thereby guiding vertical growth perpendicular to the substrate of the magnetic grains wherein the magnetic grains grow 740 with vertical sides to a predetermined pillar height 765. When the growth is complete a deposition of protective and lubricating layer 710 is made. The protective and lubricating layer 710 protects the top surfaces of the magnetic recording features 772 and magnetic alloy segregant layer 730 of one embodiment.

FIG. 8A shows for illustrative purposes only an example of pre-patterned media growth process using an ALD chemical template on hexagonal arrays of cylindrical islands of one embodiment. FIG. 8A shows a pre-patterned media growth process using an ALD chemical template 640. The pre-patterned media includes a substrate 610 with a soft underlayer (SUL) 600 deposited thereon. The process includes a seedlayer deposited on a substrate 800 with the soft underlayer (SUL) 600 deposited thereon. The process includes patterning bit patterns of hexagonal arrays of cylindrical islands 810 on the seedlayer 660. The processing includes an atomic layer deposition or PECVD of conforming spacer layer 820 where the spacer layer 630 is conforming to the bit patterns of hexagonal arrays of cylindrical islands 810 of one embodiment. Descriptions of the processing continue in FIG. 8B.

FIG. 8B shows for illustrative purposes only an example of magnetic BPM grain growth at pre-patterned sites from the bottom up of one embodiment. FIG. 8B shows continuing from FIG. 8A a selective etch to remove tops of the spacer layer and patterned resist 830. The selective etch does not affect the substrate 610, soft underlayer (SUL) 600 and seedlayer 660. Pre-patterned sections of the seedlayer 660 are exposed with the removal of the resist. A deposition of a magnetic alloy segregant in accordance with pre-patterned sites 850 is made. The magnetic alloy segregant 855 forms cylinders 857.

The magnetic alloy segregant 855 is shown transparent for illustration purposes only 860 to allow visualization of the magnetic grain growth. Magnetic grains are deposited on exposed seedlayer and are grown inside the cylinders in accordance with pre-patterned sites 840 is processed. Magnetic grains growth to a predetermined pillar height 870 is guided by the growth guiding mechanism. The magnetic grains grown form magnetic recording features with vertical sides and perpendicular to the substrate of one embodiment.

FIG. 9 shows for illustrative purposes only an example of pre-patterned media growth process modified chemical template of one embodiment. FIG. 9 shows a pre-patterned media growth process using a modified chemical template 900. The process includes the deposition of seedlayer onto a substrate with soft underlayer deposited thereon 650. A resist layer is deposited on the seedlayer 660 on the substrate 610 with the soft underlayer (SUL) 600 deposited thereon. The resist layer is processed with the block co-polymer directed self-assembly or nanoimprinting 670 forming patterned resist features 620. A directional O2 plasma to selectively oxidize seedlayer 910 to transfer the resist pattern into the seedlayer. The oxidation process reduces the height of the patterned resist features 940. A process is used to perform a strip of resist residue 950 thereby exposing non-oxidized patterned section of the seedlayer 930.

The transfer of the resist pattern produces a pattern including oxidized sections of the seedlayer 920 and non-oxidized patterned section of the seedlayer 930. A deposition of magnetic alloy segregant on oxidized seedlayer 970 is made. A deposition of magnetic grains is made on each non-oxidized patterned section of the seedlayer. The pre-patterned media growth process modified chemical template growth guiding mechanism promotes HAMR magnetic grain growth to a predetermined pillar height at non-oxidized pre-patterned sites 960. Thereafter a protective and lubricating layer 710 is deposited on the top surfaces of the magnetic grains and magnetic alloy segregant of one embodiment.

FIG. 10 shows for illustrative purposes only an example of pre-patterned media growth process topographical template of one embodiment. FIG. 10 shows a pre-patterned media growth process using a topographical template 1000 including a deposition of seedlayer onto a substrate with soft underlayer deposited thereon 650. A resist deposition is made on the seedlayer on the substrate 610 with the soft underlayer (SUL) 600 deposited thereon. A block co-polymer directed self-assembly or nanoimprinting 670 is used to create a resist layer patterned for bit-patterned media (BPM) 1010.

A selective etch of seedlayer 1020 is processed to create a patterned seedlayer 1030. A deposition of a magnetic alloy segregant is made to allow magnetic alloy segregant growth on seedlayer trenches 1050. A low thermal conductive filler 1060 is used to fill in the trenches. A magnetic alloy segregant layer 730 inhibits magnetic grain growth. A magnetic alloy including magnetic grains 720 is deposited on the tops of the patterned seedlayer 1040 to promote magnetic grain growth on flat pillars. The magnetic grains 720 grow to a predetermined pillar height as guided by the growth guiding mechanism. A protective and lubricating layer 710 is deposited on top of the magnetic grains 720 and low thermal conductive filler 1060 of one embodiment.

FIG. 11A shows for illustrative purposes only an example of a pre-patterned media growth process using a double density ALD chemical template of one embodiment. FIG. 11A shows a pre-patterned media growth process using a double density ALD chemical template 1100. The process includes the deposition of seedlayer onto a substrate with soft underlayer deposited thereon 650. A resist layer is deposited on the seedlayer 660 deposited on the substrate 610 with the soft underlayer (SUL) 600 deposited thereon. A block co-polymer directed self-assembly or nanoimprinting 670 is used to pattern the resist layer to form patterned resist features 620. An atomic layer deposition or PECVD of conforming spacer layer 820 wherein the spacer layer 630 conforms to the patterned resist features 620 of one embodiment. The processing continues in FIG. 11B.

FIG. 11B shows for illustrative purposes only an example of double density magnetic grain growth at pre-patterned sites of one embodiment. FIG. 11B shows continuing from FIG. 11A the selective etch to remove tops of the spacer layer and patterned resist 830. The spacer layer etched sections 635 is on top of the seedlayer 660 deposited on the substrate 610 with the soft underlayer (SUL) 600 deposited thereon. A process is used including an etch to remove planar sections of the spacer layer 1110 is performed leaving etched vertical sections of the spacer layer 1120. Deposition of a magnetic alloy segregant in accordance with prepatterned sites creates a growth guiding mechanism 1125. The guiding growth mechanism magnetic alloy segregant 1140 deposited on etched vertical sections of the spacer layer 1120 guides the magnetic grains growth perpendicular to the seedlayer and to a predetermined pillar height.

Grains of the magnetic alloy 1150 are deposited on the exposed surfaces of the seedlayer exposed seedlayer surfaces 720 pre-patterned sites 1155 and grow to a predetermined pillar height. Double density magnetic grain growth at pre-patterned sites 1130 takes place where the density is double that of patterned wherein the planar sections of the planar sections of the spacer layer have not been removed. A protective and lubricating layer 710 is deposited to protect the top surfaces of one embodiment.

FIG. 12A shows for illustrative purposes only an example of bit patterns on arrays of square islands of one embodiment. The predetermined pillar height includes the height of cuboids formed from square and/or rectangular shaped patterns. The cuboid magnetic features are herein referred to as squares and/or square islands. Growing the magnetic grains perpendicular to the seedlayer includes growing grains inside the square islands. The boundaries of the square islands are defined by the growth guiding mechanism in accordance with the pre-patterned seedlayer.

FIG. 12A shows a pre-patterned media growth process using a double density ALD chemical template 1100 used for bit patterns on arrays of square islands 1240. A portion of typical HAMR PMR media stack structure 1220 is shown including layers listed from the base with subsequent layers deposited on top of the preceding layer including a substrate 610, soft underlayer (SUL) 600, heatsink (HS) layer 1210, thermal resistor (TR) layer 1200, and a seedlayer 660. A resist layer is deposited on the seedlayer 660 wherein processing is used to create a resist layer patterned in arrays of square islands 1240 of one embodiment.

FIG. 12B shows for illustrative purposes only an example of resist layer patterned in arrays of square islands of one embodiment. FIG. 12B shows the substrate 610, soft underlayer (SUL) 600, heatsink (HS) layer 1210, thermal resistor (TR) layer 1200, seedlayer 660 and resist layer patterned in arrays of square islands 1240 with a conforming deposition to form the spacer layer 630 conforming to the arrays of square islands of one embodiment.

FIG. 12C shows for illustrative purposes only an example of etched patterned spacer layer in arrays of square islands of one embodiment. FIG. 12C shows a selective etch used to remove top of spacer layer and square patterned resist layer 1250 on the substrate 610, soft underlayer (SUL) 600, heatsink (HS) layer 1210, thermal resistor (TR) layer 1200, seedlayer 660, etched patterned spacer layer 1265 and planar sections of the spacer layer 1260 of one embodiment.

FIG. 12D shows for illustrative purposes only an example of etch to remove planar sections of the spacer layer of one embodiment. FIG. 12D shows the substrate 610, soft underlayer (SUL) 600, heatsink (HS) layer 1210, thermal resistor (TR) layer 1200, seedlayer 660 and etched vertical sections of the spacer layer 1120. A process is used wherein planar sections of the spacer layer are removed to expose the seedlayer 1270 of one embodiment.

FIG. 12E shows for illustrative purposes only an example of double density magnetic grain growth at pre-patterned sites of one embodiment. FIG. 12E shows the substrate 610, soft underlayer (SUL) 600, heatsink (HS) layer 1210, thermal resistor (TR) layer 1200, seedlayer 660 and etched vertical sections of the spacer layer 1120. A deposition of grains of the magnetic alloy is made to allow magnetic grain growth on exposed sections of the seedlayer 1280 of one embodiment.

FIG. 12F shows for illustrative purposes only an example of double density HAMR-BPM magnetic alloy bits in arrays of square islands of one embodiment. FIG. 12F shows the substrate 610, soft underlayer (SUL) 600, heatsink (HS) layer 1210, thermal resistor (TR) layer 1200, seedlayer 660 and etched vertical sections of the spacer layer 1120. Magnetic alloy segregant 1140 is deposited on etched vertical sections of the spacer layer 1120 to guide magnetic grain growth on exposed sections of the seedlayer 1280 to produce double density magnetic grain growth on bit patterns on arrays of square islands 1290 of one embodiment.

The foregoing has described the principles, embodiments and modes of operation of the embodiments. However, the embodiments should not be construed as being limited to the particular embodiments discussed. The above described embodiments should be regarded as illustrative rather than restrictive, and it should be appreciated that variations may be made in those embodiments by workers skilled in the art without departing from the scope of the embodiments as defined by the following claims. 

What is claimed is:
 1. A method, comprising: selectively etching a first layer of a substrate to create a bit patterned growth guiding mechanism; and growing bit patterned magnetic features guided by the growth guiding mechanism.
 2. The method of claim 1, wherein creating a bit patterned growth guiding mechanism first layer includes using an atomic layer deposition (ALD) chemical template, a modified chemical template, a topographical template, and a double density ALD chemical template.
 3. The method of claim 1, wherein guiding growing bit patterned magnetic features using the growth guiding mechanism includes guiding perpendicular magnetic recording media including heat assisted magnetic recording bit patterned media including bit patterns on hexagonal arrays of cylindrical islands, bit patterns on arrays of square islands or bit patterns using other shapes and orientations.
 4. The method of claim 1, wherein selectively etching a first layer of a substrate includes a deposition of a seedlayer material including titanium nitride, platinum, chromium alloys, magnesium oxide or other seed materials.
 5. The method of claim 1, wherein creating a bit patterned growth guiding mechanism includes using a patterning process including using a deposition of a resist layer using materials including imprint resist, directed self-assembly resist and other mask or resist materials.
 6. The method of claim 1, wherein creating a bit patterned growth guiding mechanism includes a deposition of a spacer layer using materials including oxides or metals materials.
 7. The method of claim 1, wherein growing bit patterned magnetic features includes growing magnetic grains deposited on exposed pre-patterned seedlayer surfaces to form perpendicular magnetic recording magnetic features from the pre-patterned seedlayer surfaces vertically includes using a deposition of a perpendicular magnetic layer using materials including a magnetic alloy including iron platinum or including other metal materials.
 8. The method of claim 1, wherein creating a bit patterned growth guiding mechanism includes using a deposition of a magnetic alloy segregant layer using materials including carbon, silicon oxide or other materials including oxides, nitrides, carbides, borides.
 9. The method of claim 1, wherein selectively etching a first layer of a substrate includes using processes to etch a spacer layer including using a grazing angle etch to selectively remove a section of the spacer layer on top of a patterned resist and including using an etch process to remove planar sections of the spacer layer in contact with a first layer seedlayer to enable segregating growth of magnetic grains to create unetched magnetic recording magnetic features.
 10. The method of claim 1, wherein creating a bit patterned growth guiding mechanism includes using processes including a directional oxygen (O2) plasma to selectively oxidize a first layer seedlayer to create a chemical seed pattern to enable segregated magnetic alloy segregant growth to enable forming vertical sides of the perpendicular magnetic recording magnetic features.
 11. An apparatus, comprising: a device configured to selectively etch a first layer of a substrate to create a bit patterned growth guiding mechanism; and a device configured to grow bit patterned magnetic recording features guided by the growth guiding mechanism.
 12. The apparatus of claim 11, further comprising means for pre-patterning the seedlayer including using patterns or templates including an atomic layer deposition (ALD) chemical template, a modified chemical template, a topographical template, or a double density ALD chemical template.
 13. The apparatus of claim 11, further comprising means for growing magnetic grains deposited on exposed pre-patterned seedlayer surfaces perpendicular magnetic recording magnetic features perpendicular to the substrate as guided by the growth guiding mechanism including hexagonal arrays of cylindrical pillars, arrays of square pillars or patterns using other shapes and orientations.
 14. The apparatus of claim 11, further comprising means for creating a growth guiding mechanism configured to include coating pillar and trench regions with materials including spacer layer materials including oxides or metals materials having interface energies causing highly preferential “sticking” of subsequently deposited material(s).
 15. The apparatus of claim 11, further comprising means for creating a growth guiding mechanism configured to include a magnetic alloy segregant layer that includes using carbon, silicon oxide or other materials including oxides, nitrides, carbides, borides.
 16. A structure, comprising: a first layer selectively etched on a substrate with a seedlayer deposited thereon; a first layer bit patterned growth guiding mechanism on the seedlayer; and a plurality of bit patterned magnetic recording features grown on the seedlayer guided by the growth guiding mechanism.
 17. The structure of claim 16, wherein the seedlayer is configured to include using a deposition of materials including titanium nitride, platinum, chromium alloys, magnesium oxide or other seed materials.
 18. The structure of claim 16, wherein the growth guiding mechanism is configured to include a coating of filler seed material.
 19. The structure of claim 16, wherein the growth guiding mechanism is configured to include a spacer layer includes using a deposition of materials including oxides or metals materials to segregate the growth of magnetic grains deposited on exposed pre-patterned seedlayer surfaces perpendicular to a substrate.
 20. The structure of claim 16, wherein the growth guiding mechanism is configured to include a magnetic alloy segregant layer including a deposition of materials including carbon, silicon oxide or other materials including oxides, nitrides, carbides, borides and the perpendicular magnetic layer includes a deposition of materials including a magnetic alloy including iron platinum and including other metal materials configured to grow features perpendicular to a substrate. 